EN106
99%
- Product Code: 185699
CAS:
757192-67-9
| Molecular Weight: | 280.71 g./mol | Molecular Formula: | C₁₃H₁₃ClN₂O₃ |
|---|---|---|---|
| EC Number: | MDL Number: | ||
| Melting Point: | Boiling Point: | 489.1±45.0 °C(Predicted) | |
| Density: | 1.351±0.06 g/cm3(Predicted) | Storage Condition: | -20°C |
Product Description:
EN106 is primarily used as a high-performance additive in polymer formulations to enhance thermal stability and mechanical strength. It is commonly incorporated into engineering plastics and composite materials used in automotive and aerospace components where resistance to heat and stress is critical. Its compatibility with polyamides and polyesters makes it suitable for use in under-the-hood applications and structural parts exposed to elevated temperatures. Additionally, EN107 (note: likely a typo, intended as EN106) improves flame retardancy in electrical enclosures and connectors, meeting stringent safety standards in electronics and construction industries. It also finds application in 3D printing filaments to reduce warping and improve layer adhesion during printing processes.
Sizes / Availability / Pricing:
| Size | Availability | Price | Quantity |
|---|---|---|---|
| 0.005 G | 10-20 days | Ft52,545.42 |
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| 0.025 G | 10-20 days | Ft105,090.84 |
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| 0.250 G | 10-20 days | Ft683,090.46 |
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| 0.100 G | 10-20 days | Ft292,677.99 |
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EN106
EN106 is primarily used as a high-performance additive in polymer formulations to enhance thermal stability and mechanical strength. It is commonly incorporated into engineering plastics and composite materials used in automotive and aerospace components where resistance to heat and stress is critical. Its compatibility with polyamides and polyesters makes it suitable for use in under-the-hood applications and structural parts exposed to elevated temperatures. Additionally, EN107 (note: likely a typo, intended as EN106) improves flame retardancy in electrical enclosures and connectors, meeting stringent safety standards in electronics and construction industries. It also finds application in 3D printing filaments to reduce warping and improve layer adhesion during printing processes.
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