2,2'-(((2-Hydroxypropane-1,3-diyl)bis(oxy))bis(4,1-phenylene))diacetamide
95%
- Product Code: 191780
CAS:
141650-31-9
| Molecular Weight: | 358.39 g./mol | Molecular Formula: | C₁₉H₂₂N₂O₅ |
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| Density: | Storage Condition: | 2-8°C |
Product Description:
Used as a high-performance additive in epoxy resins and composite materials, enhancing thermal stability and mechanical strength. Commonly applied in aerospace and electronics industries due to its ability to improve heat resistance and durability of coatings and encapsulants. Also utilized in specialty adhesives requiring strong bonding under extreme conditions. Shows promise in advanced 3D printing resins where thermal and chemical resistance are critical.
Sizes / Availability / Pricing:
| Size | Availability | Price | Quantity |
|---|---|---|---|
| 0.025 G | 10-20 days | ฿125,440.00 |
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2,2'-(((2-Hydroxypropane-1,3-diyl)bis(oxy))bis(4,1-phenylene))diacetamide
Used as a high-performance additive in epoxy resins and composite materials, enhancing thermal stability and mechanical strength. Commonly applied in aerospace and electronics industries due to its ability to improve heat resistance and durability of coatings and encapsulants. Also utilized in specialty adhesives requiring strong bonding under extreme conditions. Shows promise in advanced 3D printing resins where thermal and chemical resistance are critical.
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