Hexanedioic acid, bis[2-(2-hydroxyethoxy)ethyl] ester
≥95%
- Product Code: 191961
CAS:
22743-35-7
| Molecular Weight: | 322.3514 g./mol | Molecular Formula: | C₁₄H₂₆O₈ |
|---|---|---|---|
| EC Number: | MDL Number: | ||
| Melting Point: | Boiling Point: | 452.1±35.0 °C(Predicted) | |
| Density: | 1.175±0.06 g/cm3(Predicted) | Storage Condition: | 2-8°C |
Product Description:
Used as a reactive diluent and flexibilizer in epoxy resin systems, improving impact resistance and reducing brittleness without significantly lowering glass transition temperature. Commonly applied in coatings, adhesives, and encapsulants where enhanced toughness and moisture resistance are required. Its hydroxyl groups enable participation in crosslinking reactions, promoting integration into polymer networks for durable finishes in industrial and electronic applications.
Sizes / Availability / Pricing:
| Size | Availability | Price | Quantity |
|---|---|---|---|
| 0.050 G | 10-20 days | ฿240,000.00 |
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Hexanedioic acid, bis[2-(2-hydroxyethoxy)ethyl] ester
Used as a reactive diluent and flexibilizer in epoxy resin systems, improving impact resistance and reducing brittleness without significantly lowering glass transition temperature. Commonly applied in coatings, adhesives, and encapsulants where enhanced toughness and moisture resistance are required. Its hydroxyl groups enable participation in crosslinking reactions, promoting integration into polymer networks for durable finishes in industrial and electronic applications.
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