4,4'-(Hexafluoroisopropylidene)diphthalic anhydride

98%

  • Product Code: 193513
  Alias:    Hexafluorodihydride
  CAS:    1107-00-2
Molecular Weight: 444.24 g./mol Molecular Formula: C₁₉H₆F₆O₆
EC Number: 214-170-0 MDL Number: MFCD00039143
Melting Point: 244-247 °C(lit.) Boiling Point:
Density: Storage Condition: Room temperature
Product Description: Widely used in the synthesis of high-performance polyimides, this chemical contributes to the development of materials with exceptional thermal stability, mechanical strength, and dielectric properties. It is particularly valuable in the electronics industry for manufacturing flexible printed circuits, insulating films, and semiconductor coatings due to its ability to form polyimides with low dielectric constants and good solubility in organic solvents. Its fluorinated structure enhances moisture resistance and improves optical transparency, making it suitable for optoelectronic applications such as display technologies and optical waveguides. Additionally, it is employed in aerospace and microelectronics where durability under high-temperature processing is required.
Sizes / Availability / Pricing:
Size Availability Price Quantity
5g 10-20 days ฿440.00
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25g 10-20 days ฿1,760.00
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100g 10-20 days ฿5,830.00
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500g 10-20 days ฿25,990.00
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1kg 10-20 days ฿50,920.00
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4,4'-(Hexafluoroisopropylidene)diphthalic anhydride
Widely used in the synthesis of high-performance polyimides, this chemical contributes to the development of materials with exceptional thermal stability, mechanical strength, and dielectric properties. It is particularly valuable in the electronics industry for manufacturing flexible printed circuits, insulating films, and semiconductor coatings due to its ability to form polyimides with low dielectric constants and good solubility in organic solvents. Its fluorinated structure enhances moisture resistance and improves optical transparency, making it suitable for optoelectronic applications such as display technologies and optical waveguides. Additionally, it is employed in aerospace and microelectronics where durability under high-temperature processing is required.
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