Cu solution

1000µg/ml,1.0 mol/L HNO3

  • Product Code: 199369
Molecular Weight: Molecular Formula:
EC Number: MDL Number:
Melting Point: Boiling Point:
Density: Storage Condition: 2~8℃
Product Description: Used as a precursor in the synthesis of copper-based nanomaterials for electronics and catalysis. Applied in electroplating processes to deposit thin copper films on substrates for printed circuit boards. Employed in agricultural formulations as a micronutrient supplement in fertilizers to correct copper deficiency in soils. Utilized in wood preservation treatments to protect against fungal decay and insect damage. Serves as a reagent in analytical chemistry for detecting reducing sugars and in the preparation of other copper compounds. Also used in some antimicrobial coatings and solutions due to copper’s biocidal properties.
Sizes / Availability / Pricing:
Size Availability Price Quantity
50ml 10-20 days Ft14,228.34
+
-
100ml 10-20 days Ft26,409.45
+
-
Cu solution
Used as a precursor in the synthesis of copper-based nanomaterials for electronics and catalysis. Applied in electroplating processes to deposit thin copper films on substrates for printed circuit boards. Employed in agricultural formulations as a micronutrient supplement in fertilizers to correct copper deficiency in soils. Utilized in wood preservation treatments to protect against fungal decay and insect damage. Serves as a reagent in analytical chemistry for detecting reducing sugars and in the preparation of other copper compounds. Also used in some antimicrobial coatings and solutions due to copper’s biocidal properties.
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