M71-S1Pr
98%
- Product Code: 210973
CAS:
1212008-99-5
| Molecular Weight: | 821.80 g./mol | Molecular Formula: | C₃₉H₅₀N₃Cl₂F₃O₂Ru |
|---|---|---|---|
| EC Number: | MDL Number: | MFCD12545950 | |
| Melting Point: | >300 °C | Boiling Point: | |
| Density: | Storage Condition: | Room temperature, away from light, dry |
Product Description:
Used as a surface modifier in semiconductor manufacturing, enhancing adhesion between organic dielectrics and metal layers. Improves thermal stability and reduces delamination in advanced packaging applications. Also applied in microelectronics for passivation layer optimization, increasing device reliability under high-humidity conditions. Shows effectiveness in photolithography processes by minimizing interfacial defects.
Sizes / Availability / Pricing:
| Size | Availability | Price | Quantity |
|---|---|---|---|
| 100mg | 10-20 days | ฿13,150.00 |
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M71-S1Pr
Used as a surface modifier in semiconductor manufacturing, enhancing adhesion between organic dielectrics and metal layers. Improves thermal stability and reduces delamination in advanced packaging applications. Also applied in microelectronics for passivation layer optimization, increasing device reliability under high-humidity conditions. Shows effectiveness in photolithography processes by minimizing interfacial defects.
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