N1,N1'-(Butane-1,4-diyl)bis(N4-ethylbutane-1,4-diamine)
98%
- Product Code: 214721
CAS:
119422-08-1
| Molecular Weight: | 286.5 g./mol | Molecular Formula: | C₁₆H₃₈N₄ |
|---|---|---|---|
| EC Number: | MDL Number: | MFCD00871268 | |
| Melting Point: | Boiling Point: | 418.86 °C(rough estimate) | |
| Density: | 0.8603 g/cm3(rough estimate) | Storage Condition: | Room temperature, light-proof, inert gas |
Product Description:
Used as a curing agent in epoxy resin systems, providing excellent flexibility and adhesion. Its branched amine structure enables fast reaction rates at room temperature, making it suitable for coatings, adhesives, and composite materials. Offers good resistance to moisture and chemicals, enhancing durability in protective coatings for metal surfaces. Also utilized in specialty formulations requiring low viscosity and extended working time.
Sizes / Availability / Pricing:
| Size | Availability | Price | Quantity |
|---|---|---|---|
| 25mg | 10-20 days | £432.10 |
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| 100mg | 10-20 days | £1,246.75 |
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| 250mg | 10-20 days | £2,119.42 |
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N1,N1'-(Butane-1,4-diyl)bis(N4-ethylbutane-1,4-diamine)
Used as a curing agent in epoxy resin systems, providing excellent flexibility and adhesion. Its branched amine structure enables fast reaction rates at room temperature, making it suitable for coatings, adhesives, and composite materials. Offers good resistance to moisture and chemicals, enhancing durability in protective coatings for metal surfaces. Also utilized in specialty formulations requiring low viscosity and extended working time.
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