N-(Diphenylphosphoryl)-P,P-diphenylphosphinic amide
95%
- Product Code: 214903
CAS:
31239-06-2
| Molecular Weight: | 417.38 g./mol | Molecular Formula: | C₂₄H₂₁NO₂P₂ |
|---|---|---|---|
| EC Number: | MDL Number: | MFCD00482274 | |
| Melting Point: | Boiling Point: | ||
| Density: | Storage Condition: | Room temperature, seal, dry |
Product Description:
Used as a highly effective flame retardant additive in polymers, particularly in engineering plastics and epoxy resins. It functions through both gas-phase and condensed-phase mechanisms, releasing radical-scavenging species during decomposition while promoting char formation. This dual action provides strong protection against ignition and reduces heat release rates. It is thermally stable, making it suitable for high-processing-temperature applications, and shows good compatibility with various resin systems without significantly compromising mechanical properties. Commonly found in electronic encapsulants, circuit boards, and electrical insulation materials where fire safety is critical.
Sizes / Availability / Pricing:
| Size | Availability | Price | Quantity |
|---|---|---|---|
| 100mg | 10-20 days | $180.98 |
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| 250mg | 10-20 days | $307.40 |
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| 1g | 10-20 days | $829.38 |
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N-(Diphenylphosphoryl)-P,P-diphenylphosphinic amide
Used as a highly effective flame retardant additive in polymers, particularly in engineering plastics and epoxy resins. It functions through both gas-phase and condensed-phase mechanisms, releasing radical-scavenging species during decomposition while promoting char formation. This dual action provides strong protection against ignition and reduces heat release rates. It is thermally stable, making it suitable for high-processing-temperature applications, and shows good compatibility with various resin systems without significantly compromising mechanical properties. Commonly found in electronic encapsulants, circuit boards, and electrical insulation materials where fire safety is critical.
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