N,N'-(Ethane-1,2-diyl)bis(3-methylbenzenesulfonamide)
98%
- Product Code: 215609
CAS:
793713-92-5
| Molecular Weight: | 368.47 g./mol | Molecular Formula: | C₁₆H₂₀N₂O₄S₂ |
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| EC Number: | MDL Number: | ||
| Melting Point: | 158-161 °C | Boiling Point: | 569.0±60.0 °C(Predicted) |
| Density: | 1.297±0.06 g/cm3(Predicted) | Storage Condition: | Room temperature, seal, dry |
Product Description:
Used as a curing agent in epoxy resin systems, enhancing thermal and mechanical properties. Provides improved heat resistance and chemical stability in coatings, adhesives, and electrical encapsulants. Suitable for applications requiring long working time and high-performance end products, such as in aerospace, electronics, and composite materials. Also functions as a crosslinking agent in specialty polymers.
Sizes / Availability / Pricing:
| Size | Availability | Price | Quantity |
|---|---|---|---|
| 100mg | 10-20 days | Ft156,204.70 |
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| 250mg | 10-20 days | Ft265,322.80 |
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N,N'-(Ethane-1,2-diyl)bis(3-methylbenzenesulfonamide)
Used as a curing agent in epoxy resin systems, enhancing thermal and mechanical properties. Provides improved heat resistance and chemical stability in coatings, adhesives, and electrical encapsulants. Suitable for applications requiring long working time and high-performance end products, such as in aerospace, electronics, and composite materials. Also functions as a crosslinking agent in specialty polymers.
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