N1,N1'-(Ethane-1,2-diyl)bis(N1-methylbenzene-1,4-diamine)
≥95%
- Product Code: 218083
CAS:
29103-75-1
Molecular Weight: | 270.37 g./mol | Molecular Formula: | C₁₆H₂₂N₄ |
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EC Number: | MDL Number: | MFCD22376644 | |
Melting Point: | Boiling Point: | 476.4°C at 760 mmHg | |
Density: | Storage Condition: | Room temperature, away from light, stored in inert gas |
Product Description:
Used as a curing agent in epoxy resin systems, providing excellent mechanical strength and thermal stability. Commonly applied in high-performance coatings, adhesives, and composite materials for aerospace and electronics industries. Offers good flexibility and resistance to moisture, making it suitable for protective coatings in harsh environments. Also utilized in the formulation of corrosion-resistant primers and industrial maintenance paints.
Sizes / Availability / Pricing:
Size | Availability | Price | Quantity |
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100mg | 10-20 days | ฿1,880.00 |
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250mg | 10-20 days | ฿3,370.00 |
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1g | 10-20 days | ฿9,840.00 |
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5g | 10-20 days | ฿37,270.00 |
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N1,N1'-(Ethane-1,2-diyl)bis(N1-methylbenzene-1,4-diamine)
Used as a curing agent in epoxy resin systems, providing excellent mechanical strength and thermal stability. Commonly applied in high-performance coatings, adhesives, and composite materials for aerospace and electronics industries. Offers good flexibility and resistance to moisture, making it suitable for protective coatings in harsh environments. Also utilized in the formulation of corrosion-resistant primers and industrial maintenance paints.
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