4,4'-(Oxybis(4,1-phenylenesulfonyl))dianiline

98%

  • Product Code: 220969
  CAS:    54616-64-7
Molecular Weight: 480.56 g./mol Molecular Formula: C₂₄H₂₀N₂O₅S₂
EC Number: MDL Number: MFCD00625772
Melting Point: Boiling Point:
Density: Storage Condition: Room temperature, light-proof, inert gas
Product Description: Used as a high-performance curing agent and crosslinking agent in epoxy resin systems, particularly in aerospace and electronic applications due to its excellent thermal stability and mechanical strength. Enhances flame resistance and chemical resistance in cured resins. Commonly employed in composite materials, encapsulants, and insulating varnishes where long-term durability at elevated temperatures is required. Also utilized in the synthesis of polyimides and other specialty polymers for advanced engineering plastics and films.
Sizes / Availability / Pricing:
Size Availability Price Quantity
10mg 10-20 days ฿11,010.00
+
-
25mg 10-20 days ฿18,710.00
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-
50mg 10-20 days ฿31,800.00
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-
4,4'-(Oxybis(4,1-phenylenesulfonyl))dianiline
Used as a high-performance curing agent and crosslinking agent in epoxy resin systems, particularly in aerospace and electronic applications due to its excellent thermal stability and mechanical strength. Enhances flame resistance and chemical resistance in cured resins. Commonly employed in composite materials, encapsulants, and insulating varnishes where long-term durability at elevated temperatures is required. Also utilized in the synthesis of polyimides and other specialty polymers for advanced engineering plastics and films.
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