PEEK pure resin Fine powder

For molding

  • Product Code: 223616
  CAS:    29658-26-2
Molecular Weight: Molecular Formula: [OC₆H₄OC₆H₄COC₆H₄]n
EC Number: MDL Number: MFCD00217725
Melting Point: 322 °C Boiling Point:
Density: 1.3 g/mL(25 °C) Storage Condition: Room temperature
Product Description: Used in high-performance 3D printing for aerospace and medical implants due to its excellent thermal stability and mechanical strength. Commonly applied in manufacturing lightweight, durable components that withstand extreme environments. Widely used in spinal and trauma implants because of its biocompatibility and radiolucency. Employed in automotive and oil & gas industries for seals, bearings, and pump parts exposed to high temperatures and corrosive chemicals. Suitable for semiconductor manufacturing equipment due to low particle emission and high chemical resistance.
Sizes / Availability / Pricing:
Size Availability Price Quantity
25g 10-20 days ฿1,990.00
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-
100g 10-20 days ฿5,690.00
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-
PEEK pure resin Fine powder
Used in high-performance 3D printing for aerospace and medical implants due to its excellent thermal stability and mechanical strength. Commonly applied in manufacturing lightweight, durable components that withstand extreme environments. Widely used in spinal and trauma implants because of its biocompatibility and radiolucency. Employed in automotive and oil & gas industries for seals, bearings, and pump parts exposed to high temperatures and corrosive chemicals. Suitable for semiconductor manufacturing equipment due to low particle emission and high chemical resistance.
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