6-Phenylhexyldimethylchlorosilane
97%
- Product Code: 227939
CAS:
97451-53-1
| Molecular Weight: | 254.871 g./mol | Molecular Formula: | C₁₄H₂₃ClSi |
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| EC Number: | MDL Number: | ||
| Melting Point: | Boiling Point: | 320.4±21.0 °C(Predicted) | |
| Density: | 0.949±0.06 g/cm3(Predicted) | Storage Condition: | Room temperature |
Product Description:
Used as a surface modifying agent in materials science, particularly for treating silica surfaces to make them hydrophobic. Commonly applied in the production of water-repellent coatings for glass, ceramics, and electronic components. Also serves as a coupling agent in composite materials to improve compatibility between organic polymers and inorganic fillers. Its long alkyl chain with a phenyl group enhances thermal stability and improves dispersion in non-polar matrices. Frequently employed in chromatography stationary phases to adjust polarity and retention behavior. Useful in microelectronics for passivation layers due to its ability to form stable, insulating films.
Sizes / Availability / Pricing:
| Size | Availability | Price | Quantity |
|---|---|---|---|
| 1g | 10-20 days | $897.16 |
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6-Phenylhexyldimethylchlorosilane
Used as a surface modifying agent in materials science, particularly for treating silica surfaces to make them hydrophobic. Commonly applied in the production of water-repellent coatings for glass, ceramics, and electronic components. Also serves as a coupling agent in composite materials to improve compatibility between organic polymers and inorganic fillers. Its long alkyl chain with a phenyl group enhances thermal stability and improves dispersion in non-polar matrices. Frequently employed in chromatography stationary phases to adjust polarity and retention behavior. Useful in microelectronics for passivation layers due to its ability to form stable, insulating films.
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