Silicon dioxide
99.5%,20±5nm
- Product Code: 235233
Alias:
Silica, silica, silica anhydride, white carbon black, crystal, quartz, silica, silicon oxide
CAS:
60676-86-0
| Molecular Weight: | 60.08 g./mol | Molecular Formula: | SiO₂ |
|---|---|---|---|
| EC Number: | 262-373-8 | MDL Number: | MFCD00011232 |
| Melting Point: | 1610 °C(lit.) | Boiling Point: | |
| Density: | 2.3 lb/cu.ft at 25 °C (bulk density)(lit.) | Storage Condition: | Room temperature |
Product Description:
Used as a flow agent in powdered foods like spices and non-dairy creamers to prevent caking.
Commonly added to pharmaceuticals as an anti-caking agent in tablets and capsules.
Serves as a desiccant in moisture-absorbing packets for electronics and food packaging.
Acts as a reinforcing filler in rubber and silicone products, improving strength and durability.
Used in cosmetics and toothpaste as an abrasive and thickening agent.
Employed in the production of glass, ceramics, and cement due to its structural and thermal stability.
Functions as a substrate and insulating layer in semiconductor and microelectronics manufacturing.
Utilized in water treatment and filtration systems as a support medium for catalysts or adsorbents.
Sizes / Availability / Pricing:
| Size | Availability | Price | Quantity |
|---|---|---|---|
| 25g | 10-20 days | ฿360.00 |
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| 100g | 10-20 days | ฿560.00 |
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| 500g | 10-20 days | ฿1,320.00 |
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| 2.5kg | 10-20 days | ฿5,760.00 |
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| 10kg | 10-20 days | ฿18,880.00 |
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Silicon dioxide
Used as a flow agent in powdered foods like spices and non-dairy creamers to prevent caking.
Commonly added to pharmaceuticals as an anti-caking agent in tablets and capsules.
Serves as a desiccant in moisture-absorbing packets for electronics and food packaging.
Acts as a reinforcing filler in rubber and silicone products, improving strength and durability.
Used in cosmetics and toothpaste as an abrasive and thickening agent.
Employed in the production of glass, ceramics, and cement due to its structural and thermal stability.
Functions as a substrate and insulating layer in semiconductor and microelectronics manufacturing.
Utilized in water treatment and filtration systems as a support medium for catalysts or adsorbents.
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