1,1,3,3-Tetramethyl-1,3-divinyldisilazane
97%
- Product Code: 239860
Alias:
1,3-divinyl-1,1,3,3-tetramethyldisilazane
CAS:
7691-02-3
| Molecular Weight: | 185.41 g./mol | Molecular Formula: | C₈H₁₉NSi₂ |
|---|---|---|---|
| EC Number: | 231-701-1 | MDL Number: | MFCD00042846 |
| Melting Point: | Boiling Point: | 161-163 °C | |
| Density: | 0.819 | Storage Condition: | 2~8°C |
Product Description:
Used as a key precursor in the synthesis of silicon-based polymers and coatings, particularly in the production of silicone resins with enhanced thermal and oxidative stability. Its vinyl and silazane functional groups enable cross-linking reactions, making it valuable in creating protective films and encapsulants for electronic devices. Also employed in vapor deposition processes to form silicon nitride-like thin films, which serve as dielectric layers or diffusion barriers in semiconductor manufacturing. The compound’s reactivity supports its use in modifying surfaces for improved adhesion and moisture resistance in advanced materials.
Sizes / Availability / Pricing:
| Size | Availability | Price | Quantity |
|---|---|---|---|
| 5ml | 10-20 days | ฿390.00 |
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| 25ml | 10-20 days | ฿790.00 |
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| 100ml | 10-20 days | ฿2,350.00 |
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| 500ml | 10-20 days | ฿11,720.00 |
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1,1,3,3-Tetramethyl-1,3-divinyldisilazane
Used as a key precursor in the synthesis of silicon-based polymers and coatings, particularly in the production of silicone resins with enhanced thermal and oxidative stability. Its vinyl and silazane functional groups enable cross-linking reactions, making it valuable in creating protective films and encapsulants for electronic devices. Also employed in vapor deposition processes to form silicon nitride-like thin films, which serve as dielectric layers or diffusion barriers in semiconductor manufacturing. The compound’s reactivity supports its use in modifying surfaces for improved adhesion and moisture resistance in advanced materials.
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