Tin(II) Pyrophosphate
Reagent grade, 95%
- Product Code: 240419
Alias:
tin pyrophosphate; tin pyrophosphate (II); tin pyrophosphate; tin pyrophosphate
CAS:
15578-26-4
| Molecular Weight: | 411.36 g./mol | Molecular Formula: | O₇P₂Sn₂ |
|---|---|---|---|
| EC Number: | 239-635-5 | MDL Number: | MFCD00049544 |
| Melting Point: | >400°C | Boiling Point: | |
| Density: | 4.01 g/cm3 | Storage Condition: | Room temperature |
Product Description:
Used primarily in electroplating processes, especially in tin plating of electronic components and printed circuit boards. It provides a stable source of tin ions in plating baths, enabling uniform, fine-grained deposits with good solderability and corrosion resistance. The pyrophosphate-based electrolyte operates effectively at near-neutral pH, making it less corrosive to equipment and safer to handle compared to acidic baths. Also suitable for plating on sensitive substrates due to its low reactivity and minimal hydrogen embrittlement risk. Widely favored in electronics manufacturing for producing reliable, conductive coatings.
Sizes / Availability / Pricing:
| Size | Availability | Price | Quantity |
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| 25.000 | 10-20 days | $86.23 |
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| 100.000 | 10-20 days | $194.81 |
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| 500.000 | 10-20 days | $610.39 |
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| 2500.000 | 10-20 days | $1,818.18 |
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Tin(II) Pyrophosphate
Used primarily in electroplating processes, especially in tin plating of electronic components and printed circuit boards. It provides a stable source of tin ions in plating baths, enabling uniform, fine-grained deposits with good solderability and corrosion resistance. The pyrophosphate-based electrolyte operates effectively at near-neutral pH, making it less corrosive to equipment and safer to handle compared to acidic baths. Also suitable for plating on sensitive substrates due to its low reactivity and minimal hydrogen embrittlement risk. Widely favored in electronics manufacturing for producing reliable, conductive coatings.
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