tetraphenoxysilane
95%
- Product Code: 241583
CAS:
1174-72-7
| Molecular Weight: | 400.4987 g./mol | Molecular Formula: | C₂₄H₂₀O₄Si |
|---|---|---|---|
| EC Number: | MDL Number: | ||
| Melting Point: | 47-50℃ | Boiling Point: | 467.3℃at 760 mmHg |
| Density: | 1.185g/cm3 | Storage Condition: | 2-8℃ |
Product Description:
Used as a precursor in the production of silica-based thin films and coatings through chemical vapor deposition (CVD) processes. Its volatility and thermal stability make it suitable for forming high-purity silicon dioxide layers in microelectronics and semiconductor manufacturing. Also employed in sol-gel applications to create protective or functional coatings on glass and metal surfaces. Additionally, serves as a cross-linking agent in certain silicone polymers, enhancing thermal and mechanical properties.
Sizes / Availability / Pricing:
| Size | Availability | Price | Quantity |
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| 1.000 | 10-20 days | €79.13 |
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| 5.000 | 10-20 days | €265.00 |
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| 25.000 | 10-20 days | €875.72 |
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tetraphenoxysilane
Used as a precursor in the production of silica-based thin films and coatings through chemical vapor deposition (CVD) processes. Its volatility and thermal stability make it suitable for forming high-purity silicon dioxide layers in microelectronics and semiconductor manufacturing. Also employed in sol-gel applications to create protective or functional coatings on glass and metal surfaces. Additionally, serves as a cross-linking agent in certain silicone polymers, enhancing thermal and mechanical properties.
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