(Trimethyl)pentamethylcyclopentadienylplatinum(IV)
98%
- Product Code: 242951
CAS:
97262-98-1
| Molecular Weight: | 375.41 g./mol | Molecular Formula: | C₁₄H₃₀Pt |
|---|---|---|---|
| EC Number: | MDL Number: | MFCD27978428 | |
| Melting Point: | Boiling Point: | ||
| Density: | Storage Condition: | 2-8°C, light-proof, inert gas |
Product Description:
Used primarily as a precursor in metal-organic chemical vapor deposition (MOCVD) for depositing platinum-containing thin films. These films serve as conductive layers in advanced semiconductor devices, particularly in memory and logic chips. The compound’s high volatility and thermal stability enable precise, uniform coatings at relatively low temperatures, making it suitable for integration into sensitive electronic structures. It is also explored in research for catalytic applications and nanomaterials synthesis due to its ability to generate highly dispersed platinum species upon decomposition.
Sizes / Availability / Pricing:
| Size | Availability | Price | Quantity |
|---|---|---|---|
| 250mg | 10-20 days | ฿25,520.00 |
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| 1g | 10-20 days | ฿101,870.00 |
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(Trimethyl)pentamethylcyclopentadienylplatinum(IV)
Used primarily as a precursor in metal-organic chemical vapor deposition (MOCVD) for depositing platinum-containing thin films. These films serve as conductive layers in advanced semiconductor devices, particularly in memory and logic chips. The compound’s high volatility and thermal stability enable precise, uniform coatings at relatively low temperatures, making it suitable for integration into sensitive electronic structures. It is also explored in research for catalytic applications and nanomaterials synthesis due to its ability to generate highly dispersed platinum species upon decomposition.
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