(Thiodi-4,1-phenylene)bis(diphenylsulfonium) Bis(hexafluorophosphate)
≥80.0%(T)(E)
- Product Code: 243126
CAS:
74227-35-3
| Molecular Weight: | 846.745 g./mol | Molecular Formula: | C₃₆H₂₈F₁₂P₂S₃ |
|---|---|---|---|
| EC Number: | MDL Number: | MFCD03427287 | |
| Melting Point: | Boiling Point: | ||
| Density: | Storage Condition: | Room temperature, inert gas |
Product Description:
Used as a cationic photoinitiator in UV-curing systems, particularly in epoxy-based resins. It generates strong acid upon exposure to ultraviolet light, making it effective for photoacid generation in coatings, inks, and electronic materials. Commonly applied in high-resolution photolithography for semiconductor manufacturing due to its thermal stability and efficient reactivity under deep UV light. Also utilized in advanced 3D printing technologies requiring precise curing and in the production of photoresists where fine patterning and durability are critical.
Sizes / Availability / Pricing:
| Size | Availability | Price | Quantity |
|---|---|---|---|
| 5g | 10-20 days | ฿4,730.00 |
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| 25g | 10-20 days | ฿18,880.00 |
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| 100g | 10-20 days | ฿56,640.00 |
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(Thiodi-4,1-phenylene)bis(diphenylsulfonium) Bis(hexafluorophosphate)
Used as a cationic photoinitiator in UV-curing systems, particularly in epoxy-based resins. It generates strong acid upon exposure to ultraviolet light, making it effective for photoacid generation in coatings, inks, and electronic materials. Commonly applied in high-resolution photolithography for semiconductor manufacturing due to its thermal stability and efficient reactivity under deep UV light. Also utilized in advanced 3D printing technologies requiring precise curing and in the production of photoresists where fine patterning and durability are critical.
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