(Trimethyl)cyclopentadienylplatinum(IV)

98%

Product Code: 243222

CAS: 1271-07-4

Molecular Weight:	305.28 g./mol	Molecular Formula:	C₈H₁₄Pt
EC Number:		MDL Number:	MFCD07369041
Melting Point:	104-106 °C	Boiling Point:
Density:		Storage Condition:	2-8°C, Sealed, Dry, Light-proof, Inert Gas

Product Description: Used primarily as a precursor in metal-organic chemical vapor deposition (MOCVD) for depositing platinum-containing thin films. These films serve as electrodes in semiconductor devices, particularly in dynamic random-access memory (DRAM) and ferroelectric random-access memory (FeRAM) structures. The compound’s volatility and thermal stability make it suitable for high-purity platinum layer deposition at relatively low temperatures. It is also explored in the synthesis of nanostructured platinum materials for catalytic applications.

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Size	Availability	Price	Quantity
0.100	10-20 days	$169.48	+ -

(Trimethyl)cyclopentadienylplatinum(IV)

Used primarily as a precursor in metal-organic chemical vapor deposition (MOCVD) for depositing platinum-containing thin films. These films serve as electrodes in semiconductor devices, particularly in dynamic random-access memory (DRAM) and ferroelectric random-access memory (FeRAM) structures. The compound’s volatility and thermal stability make it suitable for high-purity platinum layer deposition at relatively low temperatures. It is also explored in the synthesis of nanostructured platinum materials for catalytic applications.

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(Trimethyl)cyclopentadienylplatinum(IV)

98%

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