TG-89
≥95%
- Product Code: 244743
CAS:
936091-56-4
| Molecular Weight: | 510.7 g./mol | Molecular Formula: | C₂₆H₃₄N₆O₃S |
|---|---|---|---|
| EC Number: | MDL Number: | MFCD16620524 | |
| Melting Point: | Boiling Point: | ||
| Density: | Storage Condition: | -20°C, Sealed, Dry |
Product Description:
TG-89 is primarily used as a high-performance additive in advanced polymer formulations. It enhances thermal stability and mechanical strength in engineering plastics, making it suitable for use in automotive and aerospace components exposed to extreme conditions. It is also employed in specialty coatings where resistance to heat, chemicals, and abrasion is critical. In electronics, TG-89 improves the durability of encapsulants and underfill materials, contributing to the reliability of semiconductor devices. Its reactivity allows for efficient cross-linking in epoxy resins, which are used in adhesives and composite materials requiring long-term structural integrity.
Sizes / Availability / Pricing:
| Size | Availability | Price | Quantity |
|---|---|---|---|
| 0.001 | 10-20 days | ฿15,420.00 |
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TG-89
TG-89 is primarily used as a high-performance additive in advanced polymer formulations. It enhances thermal stability and mechanical strength in engineering plastics, making it suitable for use in automotive and aerospace components exposed to extreme conditions. It is also employed in specialty coatings where resistance to heat, chemicals, and abrasion is critical. In electronics, TG-89 improves the durability of encapsulants and underfill materials, contributing to the reliability of semiconductor devices. Its reactivity allows for efficient cross-linking in epoxy resins, which are used in adhesives and composite materials requiring long-term structural integrity.
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