XY1
10mM in DMSO
- Product Code: 246033
CAS:
1624117-53-8
| Molecular Weight: | 297.35 g./mol | Molecular Formula: | C₁₇H₁₉N₃O₂ |
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| EC Number: | MDL Number: | ||
| Melting Point: | Boiling Point: | ||
| Density: | Storage Condition: | -20°C |
Product Description:
XY1 is widely used in industrial coating applications due to its excellent adhesion and resistance to environmental degradation. It serves as a key crosslinking agent in high-performance paints and protective finishes, especially for metal surfaces exposed to harsh conditions such as marine and automotive environments. Its ability to enhance scratch and UV resistance makes it valuable in exterior architectural coatings.
In the electronics industry, XY1 is utilized in encapsulants and conformal coatings to protect circuit boards from moisture, dust, and thermal stress. It improves the durability and lifespan of electronic components under fluctuating temperatures.
Additionally, XY1 is employed in adhesive formulations where strong bonding between dissimilar materials—such as plastics and metals—is required. The chemical contributes to fast curing times and high bond strength, making it suitable for assembly processes in aerospace and transportation manufacturing.
Its reactivity and stability also enable use in specialty inks and printing technologies, where consistent film formation and color retention are critical.
Sizes / Availability / Pricing:
| Size | Availability | Price | Quantity |
|---|---|---|---|
| 1ml | 10-20 days | $297.27 |
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XY1
XY1 is widely used in industrial coating applications due to its excellent adhesion and resistance to environmental degradation. It serves as a key crosslinking agent in high-performance paints and protective finishes, especially for metal surfaces exposed to harsh conditions such as marine and automotive environments. Its ability to enhance scratch and UV resistance makes it valuable in exterior architectural coatings.
In the electronics industry, XY1 is utilized in encapsulants and conformal coatings to protect circuit boards from moisture, dust, and thermal stress. It improves the durability and lifespan of electronic components under fluctuating temperatures.
Additionally, XY1 is employed in adhesive formulations where strong bonding between dissimilar materials—such as plastics and metals—is required. The chemical contributes to fast curing times and high bond strength, making it suitable for assembly processes in aerospace and transportation manufacturing.
Its reactivity and stability also enable use in specialty inks and printing technologies, where consistent film formation and color retention are critical.
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