Gold Foil, 0.025mm Thickness, 99.985% metals basis
0.025mm thick, 99.985% metals basis
- Product Code: 249681
CAS:
7440-57-5
| Molecular Weight: | 196.97 g./mol | Molecular Formula: | Au |
|---|---|---|---|
| EC Number: | 231-165-9 | MDL Number: | MFCD00003436 |
| Melting Point: | 1063 °C(lit.) | Boiling Point: | 2808 °C(lit.) |
| Density: | 19.3 g/mL at 25 °C(lit.) | Storage Condition: | Room temperature |
Product Description:
Used in semiconductor manufacturing as a bonding material for connecting silicon chips to lead frames due to its high purity and excellent electrical conductivity. Commonly applied in microelectronics for wire bonding and flip-chip assembly where reliability and minimal resistance are critical. Also utilized in aerospace and high-reliability electronics for its resistance to oxidation and stable performance under thermal cycling. Frequently employed in research and development for thin-film deposition techniques and as a calibration standard in electron microscopy. Its extreme malleability and consistent thickness make it ideal for precision applications in sensors and detectors.
Sizes / Availability / Pricing:
| Size | Availability | Price | Quantity |
|---|---|---|---|
| 25X25mm | 10-20 days | ฿18,650.00 |
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Gold Foil, 0.025mm Thickness, 99.985% metals basis
Used in semiconductor manufacturing as a bonding material for connecting silicon chips to lead frames due to its high purity and excellent electrical conductivity. Commonly applied in microelectronics for wire bonding and flip-chip assembly where reliability and minimal resistance are critical. Also utilized in aerospace and high-reliability electronics for its resistance to oxidation and stable performance under thermal cycling. Frequently employed in research and development for thin-film deposition techniques and as a calibration standard in electron microscopy. Its extreme malleability and consistent thickness make it ideal for precision applications in sensors and detectors.
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