1-Prop-2-enoxy-4-(4-prop-2-enoxyphenyl)sulfonyl-benzene
98%
- Product Code: 38722
CAS:
41481-63-4
| Molecular Weight: | 330.4 g./mol | Molecular Formula: | C₁₈H₁₈O₄S |
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| EC Number: | MDL Number: | ||
| Melting Point: | 141-142℃(Solv: ethanol (64-17-5)) | Boiling Point: | 500.7±45.0℃(Predicted) |
| Density: | 1.171±0.06 g/cm3(Predicted) | Storage Condition: | 2-8℃ |
Product Description:
This chemical is primarily utilized in the field of polymer chemistry as a key monomer in the synthesis of advanced polymeric materials. It is particularly valued for its ability to form cross-linked polymers with enhanced thermal stability and mechanical strength, making it suitable for high-performance coatings and adhesives. Additionally, it is employed in the development of specialty resins used in electronics, where its sulfonyl group contributes to improved dielectric properties. Its application also extends to the creation of photoresist materials in the semiconductor industry, where it aids in producing precise microstructures during the lithography process.
Sizes / Availability / Pricing:
| Size (g) | Availability | Price | Quantity |
|---|---|---|---|
| 0.200 | 10-20 days | ฿9,000.00 |
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1-Prop-2-enoxy-4-(4-prop-2-enoxyphenyl)sulfonyl-benzene
This chemical is primarily utilized in the field of polymer chemistry as a key monomer in the synthesis of advanced polymeric materials. It is particularly valued for its ability to form cross-linked polymers with enhanced thermal stability and mechanical strength, making it suitable for high-performance coatings and adhesives. Additionally, it is employed in the development of specialty resins used in electronics, where its sulfonyl group contributes to improved dielectric properties. Its application also extends to the creation of photoresist materials in the semiconductor industry, where it aids in producing precise microstructures during the lithography process.
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