2,2'-(2-Hydroxypropane-1,3-diyl)bis(isoindoline-1,3-dione)
97%
- Product Code: 40448
CAS:
73825-95-3
| Molecular Weight: | 350.3300 g./mol | Molecular Formula: | C₁₉H₁₄N₂O₅ |
|---|---|---|---|
| EC Number: | MDL Number: | MFCD01696968 | |
| Melting Point: | Boiling Point: | 580.4 °C at 760 mmHg | |
| Density: | 1.502g/cm3 | Storage Condition: | room temperature |
Product Description:
This chemical is primarily used as a key intermediate in the synthesis of advanced polymers and resins, particularly those requiring high thermal stability and mechanical strength. It is often incorporated into polyimide formulations, which are widely utilized in the electronics industry for manufacturing flexible printed circuit boards, insulating films, and coatings for semiconductor devices. Additionally, its structure contributes to the development of adhesives and sealants that perform well under extreme conditions, such as high temperatures or exposure to harsh chemicals. The compound’s ability to enhance the durability and performance of materials makes it valuable in aerospace, automotive, and industrial applications where reliability under stress is critical.
Sizes / Availability / Pricing:
| Size (g) | Availability | Price | Quantity |
|---|---|---|---|
| 0.250 | 10-20 days | ฿1,809.00 |
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2,2'-(2-Hydroxypropane-1,3-diyl)bis(isoindoline-1,3-dione)
This chemical is primarily used as a key intermediate in the synthesis of advanced polymers and resins, particularly those requiring high thermal stability and mechanical strength. It is often incorporated into polyimide formulations, which are widely utilized in the electronics industry for manufacturing flexible printed circuit boards, insulating films, and coatings for semiconductor devices. Additionally, its structure contributes to the development of adhesives and sealants that perform well under extreme conditions, such as high temperatures or exposure to harsh chemicals. The compound’s ability to enhance the durability and performance of materials makes it valuable in aerospace, automotive, and industrial applications where reliability under stress is critical.
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