2-(2-(Vinyloxy)ethoxy)isoindoline-1,3-dione
95%,stabilizedwithTBC
- Product Code: 42215
CAS:
391212-30-9
Molecular Weight: | 233.2200 g./mol | Molecular Formula: | C₁₂H₁₁NO₄ |
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EC Number: | MDL Number: | MFCD15142583 | |
Melting Point: | Boiling Point: | ||
Density: | Storage Condition: | room temperature |
Product Description:
This chemical is primarily utilized in the development of advanced polymeric materials, particularly in the synthesis of functional polymers and coatings. Its unique structure, featuring both vinyl and isoindoline-1,3-dione groups, makes it suitable for creating polymers with enhanced adhesion, durability, and chemical resistance. It is often employed in the production of adhesives, sealants, and protective coatings for industrial applications. Additionally, its reactivity allows it to act as a crosslinking agent, improving the mechanical properties and thermal stability of the final product. In the field of electronics, it is used in the fabrication of dielectric materials and insulating layers, contributing to the performance and reliability of electronic devices. Its versatility also extends to the pharmaceutical industry, where it serves as an intermediate in the synthesis of bioactive compounds.
Sizes / Availability / Pricing:
Size (g) | Availability | Price | Quantity |
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0.100 | 10-20 days | ฿2,007.00 |
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2-(2-(Vinyloxy)ethoxy)isoindoline-1,3-dione
This chemical is primarily utilized in the development of advanced polymeric materials, particularly in the synthesis of functional polymers and coatings. Its unique structure, featuring both vinyl and isoindoline-1,3-dione groups, makes it suitable for creating polymers with enhanced adhesion, durability, and chemical resistance. It is often employed in the production of adhesives, sealants, and protective coatings for industrial applications. Additionally, its reactivity allows it to act as a crosslinking agent, improving the mechanical properties and thermal stability of the final product. In the field of electronics, it is used in the fabrication of dielectric materials and insulating layers, contributing to the performance and reliability of electronic devices. Its versatility also extends to the pharmaceutical industry, where it serves as an intermediate in the synthesis of bioactive compounds.
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