Bis(3-allyl-4-hydroxyphenyl)sulfone
97%
- Product Code: 45808
CAS:
41481-66-7
| Molecular Weight: | 330.4 g./mol | Molecular Formula: | C₁₈H₁₈O₄S |
|---|---|---|---|
| EC Number: | MDL Number: | ||
| Melting Point: | Boiling Point: | ||
| Density: | Storage Condition: | room temperature |
Product Description:
This chemical is primarily used as a reactive intermediate in the synthesis of high-performance polymers, particularly in the production of epoxy resins and polycarbonates. Its structure allows it to act as a cross-linking agent, enhancing the thermal stability, mechanical strength, and chemical resistance of the final polymer products. It is also employed in the development of adhesives and coatings, where its properties contribute to improved durability and performance under harsh conditions. Additionally, it finds application in the electronics industry for manufacturing materials used in printed circuit boards and encapsulants, ensuring reliability in high-temperature environments.
Product Specification:
| Test | Specification |
|---|---|
| APPEARANCE | white to yellow to brown to black solid |
| PURITY | 96.5-100 |
| Infrared spectrum | Conforms to Structure |
| NMR | Conforms to Structure |
Sizes / Availability / Pricing:
| Size (g) | Availability | Price | Quantity |
|---|---|---|---|
| 10.000 | 10-20 days | ฿15,200.00 |
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| 25.000 | 10-20 days | ฿25,500.00 |
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| 100.000 | 10-20 days | ฿42,800.00 |
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Bis(3-allyl-4-hydroxyphenyl)sulfone
This chemical is primarily used as a reactive intermediate in the synthesis of high-performance polymers, particularly in the production of epoxy resins and polycarbonates. Its structure allows it to act as a cross-linking agent, enhancing the thermal stability, mechanical strength, and chemical resistance of the final polymer products. It is also employed in the development of adhesives and coatings, where its properties contribute to improved durability and performance under harsh conditions. Additionally, it finds application in the electronics industry for manufacturing materials used in printed circuit boards and encapsulants, ensuring reliability in high-temperature environments.
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