4-acryloxymethyl diphenylmethane
99%
- Product Code: 46641
CAS:
58419-97-9
| Molecular Weight: | 252.30774 g./mol | Molecular Formula: | C₁₇H₁₆O₂ |
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| Melting Point: | Boiling Point: | ||
| Density: | 1.081±0.06g/ml(Predicted) | Storage Condition: | 2-8°C, dry, sealed |
Product Description:
Used primarily in the production of specialty polymers and coatings, this compound enhances the durability and performance of materials. It is a key component in UV-curable resins, providing excellent adhesion, chemical resistance, and hardness to coatings applied on various substrates like wood, metal, and plastics. Additionally, it is utilized in the formulation of adhesives and sealants, offering strong bonding properties and stability under harsh conditions. Its role in advanced materials also extends to the electronics industry, where it contributes to the development of high-performance encapsulants and insulating materials.
Sizes / Availability / Pricing:
| Size (g) | Availability | Price | Quantity |
|---|---|---|---|
| 0.250 | 10-20 days | ฿5,004.00 |
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| 1.000 | 10-20 days | ฿15,273.00 |
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4-acryloxymethyl diphenylmethane
Used primarily in the production of specialty polymers and coatings, this compound enhances the durability and performance of materials. It is a key component in UV-curable resins, providing excellent adhesion, chemical resistance, and hardness to coatings applied on various substrates like wood, metal, and plastics. Additionally, it is utilized in the formulation of adhesives and sealants, offering strong bonding properties and stability under harsh conditions. Its role in advanced materials also extends to the electronics industry, where it contributes to the development of high-performance encapsulants and insulating materials.
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