5-ethynyl-2-(5-ethynylpyrimidin-2-yl)pyrimidine

98%

  • Product Code: 47972
  CAS:    679844-18-9
Molecular Weight: 206.20284 g./mol Molecular Formula: C₁₂H₆N₄
EC Number: MDL Number:
Melting Point: Boiling Point: 463.3±43.0℃(Predicted)
Density: 1.31±0.1g/ml(Predicted) Storage Condition: 2-8°C, dry, sealed
Product Description: This chemical is primarily utilized in the field of organic electronics and materials science due to its conjugated structure, which makes it suitable for applications in optoelectronic devices. Its ethynyl groups enable it to act as a building block for synthesizing complex organic frameworks, such as conductive polymers or molecular wires, which are essential in the development of organic light-emitting diodes (OLEDs) and organic photovoltaics (OPVs). Additionally, its pyrimidine rings contribute to its ability to form stable, planar structures, enhancing its performance in electronic applications. Researchers also explore its potential in designing molecular sensors or catalysts due to its ability to interact with various substrates through π-π stacking and hydrogen bonding.
Sizes / Availability / Pricing:
Size (g) Availability Price Quantity
0.050 10-20 days Ft221,084.70
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5-ethynyl-2-(5-ethynylpyrimidin-2-yl)pyrimidine
This chemical is primarily utilized in the field of organic electronics and materials science due to its conjugated structure, which makes it suitable for applications in optoelectronic devices. Its ethynyl groups enable it to act as a building block for synthesizing complex organic frameworks, such as conductive polymers or molecular wires, which are essential in the development of organic light-emitting diodes (OLEDs) and organic photovoltaics (OPVs). Additionally, its pyrimidine rings contribute to its ability to form stable, planar structures, enhancing its performance in electronic applications. Researchers also explore its potential in designing molecular sensors or catalysts due to its ability to interact with various substrates through π-π stacking and hydrogen bonding.
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