2,2-Bis(4-aminophenyl)hexafluoropropane
95%
- Product Code: 57811
CAS:
1095-78-9
| Molecular Weight: | 334.26 g./mol | Molecular Formula: | C₁₅H₁₂F₆N₂ |
|---|---|---|---|
| EC Number: | MDL Number: | MFCD00039146 | |
| Melting Point: | 195-198°C (Lit.) | Boiling Point: | |
| Density: | Storage Condition: | Room temperature, sealed, dry |
Product Description:
2,2-Bis(4-aminophenyl)hexafluoropropane is primarily used in the production of high-performance polymers, particularly polyimides. These polymers are known for their exceptional thermal stability, mechanical strength, and chemical resistance, making them ideal for applications in the aerospace and electronics industries. In aerospace, the material is used to manufacture components that must withstand extreme temperatures and harsh environmental conditions. In electronics, it is utilized in the production of flexible printed circuit boards, insulating films, and coatings for semiconductors, where durability and reliability are critical. Additionally, its properties make it suitable for advanced composites used in automotive and industrial applications, where lightweight yet strong materials are required.
Product Specification:
| Test | Specification |
|---|---|
| APPEARANCE | White to Light yellow to Light orange powder to crystal |
| PURITY | 94.5-100 |
| MELTING POINT C | 196.0-199.0 |
| Infrared spectrum | Conforms to Structure |
Sizes / Availability / Pricing:
| Size (g) | Availability | Price | Quantity |
|---|---|---|---|
| 1.000 | 10-20 days | ฿4,680.00 |
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| 5.000 | 10-20 days | ฿11,560.00 |
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| 25.000 | 10-20 days | ฿39,980.00 |
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2,2-Bis(4-aminophenyl)hexafluoropropane
2,2-Bis(4-aminophenyl)hexafluoropropane is primarily used in the production of high-performance polymers, particularly polyimides. These polymers are known for their exceptional thermal stability, mechanical strength, and chemical resistance, making them ideal for applications in the aerospace and electronics industries. In aerospace, the material is used to manufacture components that must withstand extreme temperatures and harsh environmental conditions. In electronics, it is utilized in the production of flexible printed circuit boards, insulating films, and coatings for semiconductors, where durability and reliability are critical. Additionally, its properties make it suitable for advanced composites used in automotive and industrial applications, where lightweight yet strong materials are required.
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