1,4-Bis(4-amino-2-trifluoromethylphenoxy)benzene
≥98%
- Product Code: 60348
CAS:
94525-05-0
Molecular Weight: | 428.33 g./mol | Molecular Formula: | C₂₀H₁₄F₆N₂O₂ |
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EC Number: | MDL Number: | MFCD07368071 | |
Melting Point: | Boiling Point: | ||
Density: | Storage Condition: | room temperature, dry |
Product Description:
This chemical is primarily used as a monomer in the synthesis of high-performance polymers, particularly polyimides and polyamides. These polymers exhibit exceptional thermal stability, mechanical strength, and chemical resistance, making them suitable for applications in aerospace, electronics, and automotive industries. In electronics, it is utilized in the production of flexible printed circuit boards and insulating films due to its excellent dielectric properties. Additionally, its resistance to harsh environments makes it valuable for coatings and adhesives in extreme conditions. The compound’s unique structure also contributes to its use in advanced materials for gas separation membranes and high-temperature filtration systems.
Product Specification:
Test | Specification |
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APPEARANCE | White to Almost white powder to crystal |
PURITY | 97.5-100 |
Infrared spectrum | Conforms to Structure |
Sizes / Availability / Pricing:
Size (g) | Availability | Price | Quantity |
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1.000 | 10-20 days | ฿360.00 |
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5.000 | 10-20 days | ฿1,200.00 |
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25.000 | 10-20 days | ฿4,390.00 |
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100.000 | 10-20 days | ฿13,820.00 |
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1,4-Bis(4-amino-2-trifluoromethylphenoxy)benzene
This chemical is primarily used as a monomer in the synthesis of high-performance polymers, particularly polyimides and polyamides. These polymers exhibit exceptional thermal stability, mechanical strength, and chemical resistance, making them suitable for applications in aerospace, electronics, and automotive industries. In electronics, it is utilized in the production of flexible printed circuit boards and insulating films due to its excellent dielectric properties. Additionally, its resistance to harsh environments makes it valuable for coatings and adhesives in extreme conditions. The compound’s unique structure also contributes to its use in advanced materials for gas separation membranes and high-temperature filtration systems.
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