4,4'-(Hexafluoroisopropylidene)bis(p-phenyleneoxy)dianiline
97%
- Product Code: 60373
Alias:
2,2-bis[4-(4-aminophenoxybenzene)]hexafluoropropane
CAS:
69563-88-8
| Molecular Weight: | 518.45 g./mol | Molecular Formula: | CF₃₂CC₆H₄OC₆H₄NH₂₂ |
|---|---|---|---|
| EC Number: | MDL Number: | MFCD00015723 | |
| Melting Point: | 159-163 °C(lit.) | Boiling Point: | |
| Density: | Storage Condition: | room temperature |
Product Description:
This chemical is widely used in the production of high-performance polymers, particularly polyimides, due to its ability to impart excellent thermal stability, mechanical strength, and chemical resistance. It serves as a key monomer in the synthesis of advanced materials for aerospace, electronics, and automotive industries. In electronics, it is utilized in the manufacture of flexible printed circuit boards and insulating films, where durability under extreme conditions is essential. Additionally, it finds application in coatings and adhesives that require high-temperature performance and long-term reliability. Its unique structure also makes it suitable for creating membranes used in gas separation processes, enhancing efficiency in industrial applications.
Product Specification:
| Test | Specification |
|---|---|
| Melting point | 162 165? |
| PURITYHPLC | 97 100% |
| PURITYTITRATION WITH HCLO4 | 96.5 103.5% |
| APPEARANCE | White to tan powder,crystals and/or chunks |
| INFRARED SPECTRUM | Conforms to Structure |
| SOLUBILITY IN METHANOL | almost transparency |
Sizes / Availability / Pricing:
| Size (g) | Availability | Price | Quantity |
|---|---|---|---|
| 5.000 | 10-20 days | ฿380.00 |
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| 25.000 | 10-20 days | ฿1,800.00 |
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| 100.000 | 10-20 days | ฿6,950.00 |
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4,4'-(Hexafluoroisopropylidene)bis(p-phenyleneoxy)dianiline
This chemical is widely used in the production of high-performance polymers, particularly polyimides, due to its ability to impart excellent thermal stability, mechanical strength, and chemical resistance. It serves as a key monomer in the synthesis of advanced materials for aerospace, electronics, and automotive industries. In electronics, it is utilized in the manufacture of flexible printed circuit boards and insulating films, where durability under extreme conditions is essential. Additionally, it finds application in coatings and adhesives that require high-temperature performance and long-term reliability. Its unique structure also makes it suitable for creating membranes used in gas separation processes, enhancing efficiency in industrial applications.
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