2,2-Bis[4-(4-maleimidophenoxy)phenyl]propane
≥98%
- Product Code: 60378
CAS:
79922-55-7
| Molecular Weight: | 570.6 g./mol | Molecular Formula: | C₃₅H₂₆N₂O₆ |
|---|---|---|---|
| EC Number: | MDL Number: | ||
| Melting Point: | 165° C | Boiling Point: | |
| Density: | Storage Condition: | room temperature, dry |
Product Description:
This chemical is primarily used as a crosslinking agent in the production of high-performance polymers and resins. It is particularly valuable in the formulation of epoxy resins, where it enhances thermal stability, mechanical strength, and chemical resistance. The compound is also utilized in the development of advanced composites for aerospace and automotive industries, providing durability and reliability under extreme conditions. Additionally, it finds application in the electronics sector for manufacturing printed circuit boards and encapsulating materials, ensuring long-term performance and protection against environmental factors. Its maleimide groups make it suitable for use in adhesives and coatings, offering excellent bonding properties and resistance to degradation.
Product Specification:
| Test | Specification |
|---|---|
| APPEARANCE | Slightly pale yellow - Yellow Crystal - Powder |
| PURITY | 98-100 |
| MELTING POINT | 163-167 |
| Infrared spectrum | Conforms to Structure |
Sizes / Availability / Pricing:
| Size (g) | Availability | Price | Quantity |
|---|---|---|---|
| 5.000 | 10-20 days | ฿790.00 |
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| 25.000 | 10-20 days | ฿3,170.00 |
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| 100.000 | 10-20 days | ฿10,800.00 |
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2,2-Bis[4-(4-maleimidophenoxy)phenyl]propane
This chemical is primarily used as a crosslinking agent in the production of high-performance polymers and resins. It is particularly valuable in the formulation of epoxy resins, where it enhances thermal stability, mechanical strength, and chemical resistance. The compound is also utilized in the development of advanced composites for aerospace and automotive industries, providing durability and reliability under extreme conditions. Additionally, it finds application in the electronics sector for manufacturing printed circuit boards and encapsulating materials, ensuring long-term performance and protection against environmental factors. Its maleimide groups make it suitable for use in adhesives and coatings, offering excellent bonding properties and resistance to degradation.
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