(Perfluoropropyl)phenyliodonium Trifluoromethanesulfonate

≥97%

  • Product Code: 62377
  CAS:    77758-79-3
Molecular Weight: 522.10 g./mol Molecular Formula: C₁₀H₅F₁₀IO₃S
EC Number: MDL Number: MFCD00135121
Melting Point: Boiling Point:
Density: Storage Condition: 2-8°C
Product Description: It is primarily used as a photoacid generator (PAG) in advanced photoresist formulations for semiconductor manufacturing. The chemical releases strong acids upon exposure to ultraviolet (UV) light, enabling precise patterning of microelectronic components during lithography processes. Its high efficiency and stability make it suitable for producing high-resolution features in integrated circuits and other nanoscale devices. Additionally, it finds application in the development of advanced materials, such as functional coatings and polymers, where controlled acid generation is required for specific chemical modifications or curing processes. Its compatibility with various substrates and its ability to operate under demanding conditions contribute to its utility in cutting-edge technology applications.
Product Specification:
Test Specification
APPEARANCE White to Light yellow powder to crystal
PURITY 96.5-100
Infrared spectrum Conforms to Structure
Sizes / Availability / Pricing:
Size (g) Availability Price Quantity
0.050 10-20 days $60.63
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0.250 10-20 days $182.31
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1.000 10-20 days $439.38
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(Perfluoropropyl)phenyliodonium Trifluoromethanesulfonate
It is primarily used as a photoacid generator (PAG) in advanced photoresist formulations for semiconductor manufacturing. The chemical releases strong acids upon exposure to ultraviolet (UV) light, enabling precise patterning of microelectronic components during lithography processes. Its high efficiency and stability make it suitable for producing high-resolution features in integrated circuits and other nanoscale devices. Additionally, it finds application in the development of advanced materials, such as functional coatings and polymers, where controlled acid generation is required for specific chemical modifications or curing processes. Its compatibility with various substrates and its ability to operate under demanding conditions contribute to its utility in cutting-edge technology applications.
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