3-Chloropropyldimethoxymethylsilane
97%
- Product Code: 63681
Alias:
3-Chloropropylmethyldimethoxysilane
CAS:
18171-19-2
Molecular Weight: | 182.72 g./mol | Molecular Formula: | C₆H₁₅ClO₂Si |
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EC Number: | MDL Number: | ||
Melting Point: | Boiling Point: | 70 °C | |
Density: | 1.025 | Storage Condition: | room temperature |
Product Description:
Used primarily as a coupling agent in the synthesis of organic-inorganic hybrid materials. It facilitates the bonding between organic polymers and inorganic surfaces, enhancing material properties such as adhesion, durability, and mechanical strength. Commonly applied in coatings, adhesives, and sealants to improve performance in harsh environments. Also utilized in the production of modified silanes for surface treatment of fillers and reinforcements in composite materials, ensuring better compatibility and dispersion within the matrix. In the electronics industry, it serves as a surface modifier for silicon-based substrates, improving interfacial properties in semiconductor devices. Additionally, it finds use in the preparation of functionalized silica nanoparticles for advanced applications in catalysis and drug delivery systems.
Product Specification:
Test | Specification |
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PurityGC | 97-100 |
REFRACTIVE INDEX N20D | 1.426-1.429 |
SPECIFIC GRAVITY 2020C | 1.026-1.03 |
APPEARANCE | COLORLESS LIQUID |
INFRARED SPECTRUM | Conforms to Structure |
Sizes / Availability / Pricing:
Size (g) | Availability | Price | Quantity |
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5.000 | 10-20 days | ฿360.00 |
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25.000 | 10-20 days | ฿1,080.00 |
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100.000 | 10-20 days | ฿4,260.00 |
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500.000 | 10-20 days | ฿13,780.00 |
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3-Chloropropyldimethoxymethylsilane
Used primarily as a coupling agent in the synthesis of organic-inorganic hybrid materials. It facilitates the bonding between organic polymers and inorganic surfaces, enhancing material properties such as adhesion, durability, and mechanical strength. Commonly applied in coatings, adhesives, and sealants to improve performance in harsh environments. Also utilized in the production of modified silanes for surface treatment of fillers and reinforcements in composite materials, ensuring better compatibility and dispersion within the matrix. In the electronics industry, it serves as a surface modifier for silicon-based substrates, improving interfacial properties in semiconductor devices. Additionally, it finds use in the preparation of functionalized silica nanoparticles for advanced applications in catalysis and drug delivery systems.
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