3-Chloropropyldimethoxymethylsilane

97%

  • Product Code: 63681
  Alias:    3-Chloropropylmethyldimethoxysilane
  CAS:    18171-19-2
Molecular Weight: 182.72 g./mol Molecular Formula: C₆H₁₅ClO₂Si
EC Number: MDL Number:
Melting Point: Boiling Point: 70 °C
Density: 1.025 Storage Condition: room temperature
Product Description: Used primarily as a coupling agent in the synthesis of organic-inorganic hybrid materials. It facilitates the bonding between organic polymers and inorganic surfaces, enhancing material properties such as adhesion, durability, and mechanical strength. Commonly applied in coatings, adhesives, and sealants to improve performance in harsh environments. Also utilized in the production of modified silanes for surface treatment of fillers and reinforcements in composite materials, ensuring better compatibility and dispersion within the matrix. In the electronics industry, it serves as a surface modifier for silicon-based substrates, improving interfacial properties in semiconductor devices. Additionally, it finds use in the preparation of functionalized silica nanoparticles for advanced applications in catalysis and drug delivery systems.
Product Specification:
Test Specification
PurityGC 97-100
REFRACTIVE INDEX N20D 1.426-1.429
SPECIFIC GRAVITY 2020C 1.026-1.03
APPEARANCE COLORLESS LIQUID
INFRARED SPECTRUM Conforms to Structure
Sizes / Availability / Pricing:
Size (g) Availability Price Quantity
5.000 10-20 days ฿360.00
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25.000 10-20 days ฿1,080.00
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100.000 10-20 days ฿4,260.00
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500.000 10-20 days ฿13,780.00
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3-Chloropropyldimethoxymethylsilane
Used primarily as a coupling agent in the synthesis of organic-inorganic hybrid materials. It facilitates the bonding between organic polymers and inorganic surfaces, enhancing material properties such as adhesion, durability, and mechanical strength. Commonly applied in coatings, adhesives, and sealants to improve performance in harsh environments. Also utilized in the production of modified silanes for surface treatment of fillers and reinforcements in composite materials, ensuring better compatibility and dispersion within the matrix. In the electronics industry, it serves as a surface modifier for silicon-based substrates, improving interfacial properties in semiconductor devices. Additionally, it finds use in the preparation of functionalized silica nanoparticles for advanced applications in catalysis and drug delivery systems.
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