N-(3-TRIMETHOXYSILYLPROPYL)PYRROLE

97%

  • Product Code: 63738
  CAS:    80906-67-8
Molecular Weight: 229.35 g./mol Molecular Formula: C₁₀H₁₉NO₃Si
EC Number: MDL Number:
Melting Point: Boiling Point: 105 °C
Density: Storage Condition: Room temperature, sealed, dry
Product Description: This chemical is primarily used as a coupling agent in the surface modification of various materials. It is particularly effective in enhancing the adhesion between organic polymers and inorganic substrates, such as glass, metals, and ceramics. This makes it valuable in the production of composite materials, where improved bonding is essential for mechanical strength and durability. In the coatings industry, it is employed to improve the performance of paints and adhesives by ensuring better surface interaction and resistance to environmental factors like moisture and UV exposure. Additionally, it is utilized in the preparation of functionalized surfaces for biomedical applications, where it aids in the immobilization of biomolecules or cells on solid supports. Its ability to form stable bonds also makes it suitable for use in electronics, particularly in the fabrication of sensors and devices requiring precise surface engineering.
Sizes / Availability / Pricing:
Size (g) Availability Price Quantity
5.000 10-20 days ฿35,100.00
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N-(3-TRIMETHOXYSILYLPROPYL)PYRROLE
This chemical is primarily used as a coupling agent in the surface modification of various materials. It is particularly effective in enhancing the adhesion between organic polymers and inorganic substrates, such as glass, metals, and ceramics. This makes it valuable in the production of composite materials, where improved bonding is essential for mechanical strength and durability. In the coatings industry, it is employed to improve the performance of paints and adhesives by ensuring better surface interaction and resistance to environmental factors like moisture and UV exposure. Additionally, it is utilized in the preparation of functionalized surfaces for biomedical applications, where it aids in the immobilization of biomolecules or cells on solid supports. Its ability to form stable bonds also makes it suitable for use in electronics, particularly in the fabrication of sensors and devices requiring precise surface engineering.
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