(1-Phenylvinyl)phosphonic acid

95% mix TBC as stabilizer

  • Product Code: 76904
  CAS:    3220-50-6
Molecular Weight: 184.13 g./mol Molecular Formula: C₈H₉O₃P
EC Number: MDL Number: MFCD00013953
Melting Point: Boiling Point: 399.4 °C at 760 mmHg (lit.)
Density: Storage Condition: 2-8°C, inert gas
Product Description: This chemical is primarily used in the field of materials science, particularly in the development of surface modification techniques. It is often employed as a functionalizing agent for metal oxides and other inorganic surfaces, enhancing their compatibility with organic polymers. This property makes it valuable in creating hybrid materials with improved mechanical and thermal properties. In the realm of organic electronics, it serves as an interfacial layer in devices such as organic light-emitting diodes (OLEDs) and organic photovoltaics (OPVs). Its ability to form stable bonds with substrates helps in improving charge injection and transport, leading to enhanced device performance. Additionally, it is utilized in the synthesis of advanced coatings and adhesives, where its phosphonic acid group provides strong adhesion to various substrates, including metals and ceramics. This makes it suitable for applications requiring durable and corrosion-resistant surfaces. In biomedical applications, it is explored for modifying implant surfaces to improve biocompatibility and promote better integration with biological tissues. Its chemical structure allows for the attachment of bioactive molecules, making it a promising candidate for developing functionalized biomaterials.
Sizes / Availability / Pricing:
Size (g) Availability Price Quantity
1.000 10-20 days ฿39,564.00
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(1-Phenylvinyl)phosphonic acid
This chemical is primarily used in the field of materials science, particularly in the development of surface modification techniques. It is often employed as a functionalizing agent for metal oxides and other inorganic surfaces, enhancing their compatibility with organic polymers. This property makes it valuable in creating hybrid materials with improved mechanical and thermal properties. In the realm of organic electronics, it serves as an interfacial layer in devices such as organic light-emitting diodes (OLEDs) and organic photovoltaics (OPVs). Its ability to form stable bonds with substrates helps in improving charge injection and transport, leading to enhanced device performance. Additionally, it is utilized in the synthesis of advanced coatings and adhesives, where its phosphonic acid group provides strong adhesion to various substrates, including metals and ceramics. This makes it suitable for applications requiring durable and corrosion-resistant surfaces. In biomedical applications, it is explored for modifying implant surfaces to improve biocompatibility and promote better integration with biological tissues. Its chemical structure allows for the attachment of bioactive molecules, making it a promising candidate for developing functionalized biomaterials.
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