2,7-Bis(4,4,5,5-tetramethyl-1,3,2- dioxaborolan-2-yl)-9,9-didecylfluorene

>98.0%(HPLC)

  • Product Code: 77080
  CAS:    711026-06-1
Molecular Weight: 698.69 g./mol Molecular Formula: C₄₅H₇₂B₂O₄
EC Number: MDL Number: MFCD20275090
Melting Point: 118° C Boiling Point:
Density: Storage Condition: room temperature
Product Description: This chemical is primarily used in the field of organic electronics, particularly in the development of organic light-emitting diodes (OLEDs) and organic photovoltaics (OPVs). Its structure makes it a valuable building block for creating conjugated polymers and small molecules, which are essential for efficient charge transport and light emission in these devices. The compound is often employed in the synthesis of low-bandgap materials, which are crucial for improving the efficiency of solar cells by absorbing a broader range of sunlight. Additionally, its boron-containing groups facilitate cross-coupling reactions, enabling the construction of complex organic frameworks with tailored electronic properties. This makes it a key component in advancing next-generation flexible and lightweight electronic devices.
Sizes / Availability / Pricing:
Size (g) Availability Price Quantity
0.250 10-20 days ฿5,571.00
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2,7-Bis(4,4,5,5-tetramethyl-1,3,2- dioxaborolan-2-yl)-9,9-didecylfluorene
This chemical is primarily used in the field of organic electronics, particularly in the development of organic light-emitting diodes (OLEDs) and organic photovoltaics (OPVs). Its structure makes it a valuable building block for creating conjugated polymers and small molecules, which are essential for efficient charge transport and light emission in these devices. The compound is often employed in the synthesis of low-bandgap materials, which are crucial for improving the efficiency of solar cells by absorbing a broader range of sunlight. Additionally, its boron-containing groups facilitate cross-coupling reactions, enabling the construction of complex organic frameworks with tailored electronic properties. This makes it a key component in advancing next-generation flexible and lightweight electronic devices.
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