3,3'-[oxybis(ethane-2,1-diyloxy)]dipropanenitrile
98%
- Product Code: 80510
CAS:
22397-31-5
Molecular Weight: | 212.2456 g./mol | Molecular Formula: | C₁₀H₁₆N₂O₃ |
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EC Number: | MDL Number: | MFCD00019872 | |
Melting Point: | Boiling Point: | 392.4 °C at 760 mmHg | |
Density: | 1.064 g/cm3 | Storage Condition: | 2-8°C |
Product Description:
This chemical is primarily utilized in the synthesis of specialized polymers and resins, where its unique structure contributes to the enhancement of flexibility and durability in the final product. It is also employed in the production of adhesives and coatings, providing improved adhesion and resistance to environmental factors. Additionally, it serves as an intermediate in organic synthesis, particularly in the development of pharmaceuticals and agrochemicals, where its reactivity and stability are advantageous. In the field of electronics, it is used in the formulation of encapsulants and sealants, offering protection to sensitive components from moisture and mechanical stress.
Product Specification:
Test | Specification |
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APPEARANCE | liquid |
PURITY | 97.5-100 |
Infrared spectrum | Conforms to Structure |
NMR | Conforms to Structure |
Sizes / Availability / Pricing:
Size (g) | Availability | Price | Quantity |
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1.000 | 10-20 days | ฿1,500.00 |
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5.000 | 10-20 days | ฿5,800.00 |
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3,3'-[oxybis(ethane-2,1-diyloxy)]dipropanenitrile
This chemical is primarily utilized in the synthesis of specialized polymers and resins, where its unique structure contributes to the enhancement of flexibility and durability in the final product. It is also employed in the production of adhesives and coatings, providing improved adhesion and resistance to environmental factors. Additionally, it serves as an intermediate in organic synthesis, particularly in the development of pharmaceuticals and agrochemicals, where its reactivity and stability are advantageous. In the field of electronics, it is used in the formulation of encapsulants and sealants, offering protection to sensitive components from moisture and mechanical stress.
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