Triethoxy-2-thienylsilane
97%
- Product Code: 88288
CAS:
17984-89-3
Molecular Weight: | 246.4 g./mol | Molecular Formula: | C₁₀H₁₈O₃SSi |
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EC Number: | MDL Number: | MFCD05664345 | |
Melting Point: | Boiling Point: | 78 °C at 0.5 mmHg (lit.) | |
Density: | 1.049 g/mL at 25 °C (lit.) | Storage Condition: | 2-8°C |
Product Description:
Triethoxy-2-thienylsilane is primarily used as a coupling agent in the field of materials science, particularly in the modification of surfaces and interfaces. It is often employed to enhance the adhesion between organic polymers and inorganic materials, such as glass, metals, or ceramics. This chemical is valuable in the production of hybrid materials, where it acts as a bridge, improving compatibility and performance in composite systems.
In the electronics industry, it is utilized in the fabrication of organic electronic devices, such as organic field-effect transistors (OFETs) and sensors, due to its ability to functionalize surfaces and promote charge transport. Additionally, it finds application in coatings and adhesives, where its silane group enables strong bonding to substrates, while the thienyl group contributes to the material’s electronic properties. Its versatility makes it a key component in advanced material design and nanotechnology applications.
Product Specification:
Test | Specification |
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APPEARANCE | Colorless Liquid |
PURITY | 96.5-100 |
Infrared spectrum | Conforms to Structure |
NMR | Conforms to Structure |
Sizes / Availability / Pricing:
Size (g) | Availability | Price | Quantity |
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1.000 | 10-20 days | ฿3,930.00 |
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5.000 | 10-20 days | ฿15,180.00 |
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25.000 | 10-20 days | ฿50,600.00 |
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Triethoxy-2-thienylsilane
Triethoxy-2-thienylsilane is primarily used as a coupling agent in the field of materials science, particularly in the modification of surfaces and interfaces. It is often employed to enhance the adhesion between organic polymers and inorganic materials, such as glass, metals, or ceramics. This chemical is valuable in the production of hybrid materials, where it acts as a bridge, improving compatibility and performance in composite systems.
In the electronics industry, it is utilized in the fabrication of organic electronic devices, such as organic field-effect transistors (OFETs) and sensors, due to its ability to functionalize surfaces and promote charge transport. Additionally, it finds application in coatings and adhesives, where its silane group enables strong bonding to substrates, while the thienyl group contributes to the material’s electronic properties. Its versatility makes it a key component in advanced material design and nanotechnology applications.
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