Trimethoxy[2-(7-oxabicyclo[4.1.0]hept-3-yl)ethyl]silane
99%
- Product Code: 88335
CAS:
3388-04-3
| Molecular Weight: | 246.38 g./mol | Molecular Formula: | C₁₁H₂₂O₄Si |
|---|---|---|---|
| EC Number: | MDL Number: | MFCD00014485 | |
| Melting Point: | Boiling Point: | 310 °C(lit.) | |
| Density: | 1.065 g/mL at 25 °C(lit.) | Storage Condition: | 2~8°C, sealed |
Product Description:
This chemical is primarily used as a coupling agent in the field of materials science, particularly in the modification of surfaces and interfaces. It is often employed to enhance the adhesion between organic polymers and inorganic materials, such as glass, metals, or ceramics. This is especially useful in the production of composite materials, where it improves the mechanical properties and durability of the final product.
In the coatings industry, it is utilized to create more stable and resistant surface treatments, providing better water repellency and corrosion protection. Additionally, it finds application in the synthesis of specialized adhesives and sealants, where it contributes to improved bonding performance and longevity.
In the realm of electronics, this compound is used to modify the surface of electronic components, enhancing their compatibility with other materials and improving overall device performance. Its ability to form strong bonds with both organic and inorganic substrates makes it a versatile and valuable component in advanced material engineering.
Product Specification:
| Test | Specification |
|---|---|
| PurityGC | 98.5 100% |
| Infrared Spectrum | Conforms to Structure |
| Appearance | Colorless to Almost Colorless to Yellow Liquid |
Sizes / Availability / Pricing:
| Size (g) | Availability | Price | Quantity |
|---|---|---|---|
| 5.000 | 10-20 days | ฿330.00 |
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| 25.000 | 10-20 days | ฿450.00 |
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| 100.000 | 10-20 days | ฿810.00 |
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| 500.000 | 10-20 days | ฿3,200.00 |
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| 2500.000 | 10-20 days | ฿15,860.00 |
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Trimethoxy[2-(7-oxabicyclo[4.1.0]hept-3-yl)ethyl]silane
This chemical is primarily used as a coupling agent in the field of materials science, particularly in the modification of surfaces and interfaces. It is often employed to enhance the adhesion between organic polymers and inorganic materials, such as glass, metals, or ceramics. This is especially useful in the production of composite materials, where it improves the mechanical properties and durability of the final product.
In the coatings industry, it is utilized to create more stable and resistant surface treatments, providing better water repellency and corrosion protection. Additionally, it finds application in the synthesis of specialized adhesives and sealants, where it contributes to improved bonding performance and longevity.
In the realm of electronics, this compound is used to modify the surface of electronic components, enhancing their compatibility with other materials and improving overall device performance. Its ability to form strong bonds with both organic and inorganic substrates makes it a versatile and valuable component in advanced material engineering.
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