Tris(trimethylsilyl)silanol
95%
- Product Code: 88349
CAS:
7428-60-6
| Molecular Weight: | 264.66 g./mol | Molecular Formula: | C₉H₂₈OSi₄ |
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| EC Number: | MDL Number: | MFCD00093727 | |
| Melting Point: | Boiling Point: | ||
| Density: | 0.859 g/cm3 at 25 °C (lit.) | Storage Condition: | room temperature |
Product Description:
Tris(trimethylsilyl)silanol is widely used in the field of materials science, particularly in the synthesis of advanced polymers and silicone-based materials. It serves as a key intermediate in the production of silicon-containing compounds, which are essential for creating high-performance coatings, adhesives, and sealants. Its unique structure allows it to act as a crosslinking agent, enhancing the thermal stability and mechanical properties of the final products.
In the electronics industry, it is utilized in the fabrication of semiconductor devices and insulating materials. Its ability to form stable silicon-oxygen bonds makes it valuable for producing thin films and protective layers that improve the durability and efficiency of electronic components. Additionally, it finds application in surface modification processes, where it is used to impart hydrophobic properties to various substrates, making them resistant to moisture and environmental degradation.
Sizes / Availability / Pricing:
| Size (g) | Availability | Price | Quantity |
|---|---|---|---|
| 1.000 | 10-20 days | $938.99 |
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Tris(trimethylsilyl)silanol
Tris(trimethylsilyl)silanol is widely used in the field of materials science, particularly in the synthesis of advanced polymers and silicone-based materials. It serves as a key intermediate in the production of silicon-containing compounds, which are essential for creating high-performance coatings, adhesives, and sealants. Its unique structure allows it to act as a crosslinking agent, enhancing the thermal stability and mechanical properties of the final products.
In the electronics industry, it is utilized in the fabrication of semiconductor devices and insulating materials. Its ability to form stable silicon-oxygen bonds makes it valuable for producing thin films and protective layers that improve the durability and efficiency of electronic components. Additionally, it finds application in surface modification processes, where it is used to impart hydrophobic properties to various substrates, making them resistant to moisture and environmental degradation.
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