2-(ACRYLOXYETHOXY)TRIMETHYLSILANE
97%
- Product Code: 88359
CAS:
18269-99-3
Molecular Weight: | 188.3 g./mol | Molecular Formula: | C₈H₁₆O₃Si |
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EC Number: | MDL Number: | ||
Melting Point: | Boiling Point: | 90 °C | |
Density: | Storage Condition: | -20°C, sealed, dry |
Product Description:
This chemical is primarily used as a coupling agent in various industrial applications. It is particularly effective in enhancing adhesion between organic polymers and inorganic materials, making it valuable in coatings, adhesives, and sealants. It is also utilized in the modification of surfaces to improve water repellency and durability, especially in glass, ceramics, and metals. Additionally, it plays a role in the production of silicone-based materials, where it helps in cross-linking and stabilizing the final product. Its application extends to the electronics industry, where it is used in the fabrication of semiconductors and protective coatings for electronic components.
Product Specification:
Test | Specification |
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APPEARANCE | Colorless Liquid |
PURITY | 96.5-100 |
Infrared spectrum | Conforms to Structure |
NMR | Conforms to Structure |
Sizes / Availability / Pricing:
Size (g) | Availability | Price | Quantity |
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1.000 | 10-20 days | ฿2,290.00 |
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5.000 | 10-20 days | ฿9,800.00 |
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25.000 | 10-20 days | ฿26,000.00 |
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2-(ACRYLOXYETHOXY)TRIMETHYLSILANE
This chemical is primarily used as a coupling agent in various industrial applications. It is particularly effective in enhancing adhesion between organic polymers and inorganic materials, making it valuable in coatings, adhesives, and sealants. It is also utilized in the modification of surfaces to improve water repellency and durability, especially in glass, ceramics, and metals. Additionally, it plays a role in the production of silicone-based materials, where it helps in cross-linking and stabilizing the final product. Its application extends to the electronics industry, where it is used in the fabrication of semiconductors and protective coatings for electronic components.
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