(chloromethyl)(ethoxy)dimethylsilane
97%
- Product Code: 88368
Alias:
Chloromethyldimethylethoxysilane
CAS:
13508-53-7
Properties:
liquid
Molecular Weight: | 152.69 g./mol | Molecular Formula: | C₅H₁₃ClOSi |
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EC Number: | 236-835-4 | MDL Number: | MFCD00045263 |
Melting Point: | Boiling Point: | 129.6 ºC | |
Density: | 0.927g/cm3 | Storage Condition: | 2~8°C, sealed |
Product Description:
Used primarily in the synthesis of silicone-based polymers and resins, this compound serves as a key intermediate in the production of materials with enhanced adhesion, flexibility, and durability. It is often employed in coatings, sealants, and adhesives to improve their performance in various industrial and construction applications. Additionally, it plays a role in the modification of surfaces to impart water repellency or chemical resistance, making it valuable in the manufacturing of protective coatings for textiles, electronics, and automotive components. Its reactivity with organic and inorganic substrates also makes it useful in crosslinking processes to create stable, high-performance materials.
Product Specification:
Test | Specification |
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PurityGC | 96.5-100 |
Appearance | colorless liguid |
Infrared Spectrum | Conforms to Structure |
Sizes / Availability / Pricing:
Size (g) | Availability | Price | Quantity |
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1.000 | 10-20 days | ฿560.00 |
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5.000 | 10-20 days | ฿1,680.00 |
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25.000 | 10-20 days | ฿5,600.00 |
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(chloromethyl)(ethoxy)dimethylsilane
Used primarily in the synthesis of silicone-based polymers and resins, this compound serves as a key intermediate in the production of materials with enhanced adhesion, flexibility, and durability. It is often employed in coatings, sealants, and adhesives to improve their performance in various industrial and construction applications. Additionally, it plays a role in the modification of surfaces to impart water repellency or chemical resistance, making it valuable in the manufacturing of protective coatings for textiles, electronics, and automotive components. Its reactivity with organic and inorganic substrates also makes it useful in crosslinking processes to create stable, high-performance materials.
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