(chloromethyl)(ethoxy)dimethylsilane

97%

  • Product Code: 88368
  Alias:    Chloromethyldimethylethoxysilane
  CAS:    13508-53-7
  Properties:    liquid
Molecular Weight: 152.69 g./mol Molecular Formula: C₅H₁₃ClOSi
EC Number: 236-835-4 MDL Number: MFCD00045263
Melting Point: Boiling Point: 129.6 ºC
Density: 0.927g/cm3 Storage Condition: 2~8°C, sealed
Product Description: Used primarily in the synthesis of silicone-based polymers and resins, this compound serves as a key intermediate in the production of materials with enhanced adhesion, flexibility, and durability. It is often employed in coatings, sealants, and adhesives to improve their performance in various industrial and construction applications. Additionally, it plays a role in the modification of surfaces to impart water repellency or chemical resistance, making it valuable in the manufacturing of protective coatings for textiles, electronics, and automotive components. Its reactivity with organic and inorganic substrates also makes it useful in crosslinking processes to create stable, high-performance materials.
Product Specification:
Test Specification
PurityGC 96.5-100
Appearance colorless liguid
Infrared Spectrum Conforms to Structure
Sizes / Availability / Pricing:
Size (g) Availability Price Quantity
1.000 10-20 days ฿560.00
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-
5.000 10-20 days ฿1,680.00
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-
25.000 10-20 days ฿5,600.00
+
-
(chloromethyl)(ethoxy)dimethylsilane
Used primarily in the synthesis of silicone-based polymers and resins, this compound serves as a key intermediate in the production of materials with enhanced adhesion, flexibility, and durability. It is often employed in coatings, sealants, and adhesives to improve their performance in various industrial and construction applications. Additionally, it plays a role in the modification of surfaces to impart water repellency or chemical resistance, making it valuable in the manufacturing of protective coatings for textiles, electronics, and automotive components. Its reactivity with organic and inorganic substrates also makes it useful in crosslinking processes to create stable, high-performance materials.
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