Dimethylphenylsilane
98%
- Product Code: 88445
Alias:
Dimethylphenylsilane
CAS:
766-77-8
Molecular Weight: | 136.27 g./mol | Molecular Formula: | C₈H₁₂Si |
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EC Number: | 212-170-5 | MDL Number: | MFCD00008257 |
Melting Point: | 323-329 °C(lit.) | Boiling Point: | 157 °C744 mm Hg(lit.) |
Density: | 0.889 g/mL at 25 °C(lit.) | Storage Condition: | 2~8°C |
Product Description:
Dimethylphenylsilane is widely used in the production of silicone polymers and resins, where it acts as a key intermediate. It is particularly valuable in the synthesis of phenyl-modified silicones, which are known for their enhanced thermal stability and resistance to oxidation. These silicones are commonly applied in high-temperature lubricants, sealants, and coatings for industrial and automotive applications. Additionally, it serves as a reagent in organic synthesis, especially in hydrosilylation reactions, to introduce phenyl groups into various organic compounds. Its role in creating specialty materials for electronics, such as encapsulants and adhesives, is also notable due to its ability to improve material properties like flexibility and durability.
Product Specification:
Test | Specification |
---|---|
PurityGC | 97.5-100 |
REFRACTIVE INDEX N20D | 1.479-1.501 |
SPECIFIC GRAVITY 2020C | 0.875-0.881 |
APPEARANCE | COLORLESS LIQUID |
INFRARED SPECTRUM | Conforms to Structure |
Sizes / Availability / Pricing:
Size (g) | Availability | Price | Quantity |
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5.000 | 10-20 days | ฿740.00 |
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25.000 | 10-20 days | ฿2,460.00 |
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100.000 | 10-20 days | ฿9,240.00 |
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Dimethylphenylsilane
Dimethylphenylsilane is widely used in the production of silicone polymers and resins, where it acts as a key intermediate. It is particularly valuable in the synthesis of phenyl-modified silicones, which are known for their enhanced thermal stability and resistance to oxidation. These silicones are commonly applied in high-temperature lubricants, sealants, and coatings for industrial and automotive applications. Additionally, it serves as a reagent in organic synthesis, especially in hydrosilylation reactions, to introduce phenyl groups into various organic compounds. Its role in creating specialty materials for electronics, such as encapsulants and adhesives, is also notable due to its ability to improve material properties like flexibility and durability.
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