Octakis(dimethylsilyloxy)octasilsesquioxane

≥95%

  • Product Code: 88470
  Alias:    Dimethylsilyl clathrate polysilsesquioxane
  CAS:    125756-69-6
Molecular Weight: 1017.96 g./mol Molecular Formula: C₁₆H₅₆O₂₀Si₁₆
EC Number: MDL Number: MFCD03701363
Melting Point: Boiling Point:
Density: Storage Condition: room temperature
Product Description: Primarily used in the production of advanced materials, this chemical serves as a key component in the synthesis of hybrid organic-inorganic polymers. Its unique structure enhances thermal stability and mechanical properties, making it ideal for high-performance coatings and composites. In the electronics industry, it is utilized to create dielectric materials with low dielectric constants, essential for next-generation semiconductors. Additionally, it finds application in the development of flame-retardant additives, improving the safety of various materials. Its versatility also extends to the field of nanotechnology, where it is employed in the fabrication of nanostructured materials with tailored properties.
Product Specification:
Test Specification
APPEARANCE White to Almost white powder to crystal
PURITY 94.5-100
Infrared spectrum Conforms to Structure
NMR Conforms to Structure
Sizes / Availability / Pricing:
Size (g) Availability Price Quantity
0.200 10-20 days ฿2,060.00
+
-
1.000 10-20 days ฿10,080.00
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-
Octakis(dimethylsilyloxy)octasilsesquioxane
Primarily used in the production of advanced materials, this chemical serves as a key component in the synthesis of hybrid organic-inorganic polymers. Its unique structure enhances thermal stability and mechanical properties, making it ideal for high-performance coatings and composites. In the electronics industry, it is utilized to create dielectric materials with low dielectric constants, essential for next-generation semiconductors. Additionally, it finds application in the development of flame-retardant additives, improving the safety of various materials. Its versatility also extends to the field of nanotechnology, where it is employed in the fabrication of nanostructured materials with tailored properties.
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