Hexachlorodisilane
96%
- Product Code: 88480
CAS:
13465-77-5
| Molecular Weight: | 268.87 g./mol | Molecular Formula: | Cl₆Si₂ |
|---|---|---|---|
| EC Number: | MDL Number: | MFCD00011599 | |
| Melting Point: | Boiling Point: | 144-145.5°C (Lit.) | |
| Density: | Storage Condition: | 2~8℃,Seal |
Product Description:
Hexachlorodisilane is primarily used in the semiconductor industry as a precursor for silicon deposition in chemical vapor deposition (CVD) processes. It plays a critical role in the production of silicon-based thin films and coatings, which are essential for manufacturing integrated circuits and other electronic components. Additionally, it is employed in the synthesis of silicon-containing polymers and ceramics, where it serves as a key intermediate. Its ability to form high-purity silicon layers makes it valuable in advanced materials research and development, particularly in creating nanostructures and specialized coatings for optical and electronic applications.
Product Specification:
| Test | Specification |
|---|---|
| APPEARANCE | Colorless Liquid |
| PURITY | 95.5-100 |
| Infrared spectrum | Conforms to Structure |
| NMR | Conforms to Structure |
Sizes / Availability / Pricing:
| Size (g) | Availability | Price | Quantity |
|---|---|---|---|
| 1.000 | 10-20 days | ฿4,900.00 |
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| 5.000 | 10-20 days | ฿20,280.00 |
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Hexachlorodisilane
Hexachlorodisilane is primarily used in the semiconductor industry as a precursor for silicon deposition in chemical vapor deposition (CVD) processes. It plays a critical role in the production of silicon-based thin films and coatings, which are essential for manufacturing integrated circuits and other electronic components. Additionally, it is employed in the synthesis of silicon-containing polymers and ceramics, where it serves as a key intermediate. Its ability to form high-purity silicon layers makes it valuable in advanced materials research and development, particularly in creating nanostructures and specialized coatings for optical and electronic applications.
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