Hexamethoxydisilane
95%
- Product Code: 88487
CAS:
5851-07-0
Molecular Weight: | 242.37 g./mol | Molecular Formula: | C₆H₁₈O₆Si₂ |
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EC Number: | MDL Number: | ||
Melting Point: | Boiling Point: | 98 °C /20 mmHg | |
Density: | Storage Condition: | 2-8°C, sealed, dry |
Product Description:
Used primarily in the production of silicon-based materials, it serves as a key precursor in the synthesis of silica gels and other silicon compounds. Its application extends to the semiconductor industry, where it is utilized in chemical vapor deposition (CVD) processes to create thin films essential for electronic devices. Additionally, it plays a role in the development of coatings and adhesives, enhancing their durability and performance. In research, it is employed to modify surfaces, improving their properties for specific industrial applications.
Sizes / Availability / Pricing:
Size (g) | Availability | Price | Quantity |
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5.000 | 10-20 days | ฿28,800.00 |
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Hexamethoxydisilane
Used primarily in the production of silicon-based materials, it serves as a key precursor in the synthesis of silica gels and other silicon compounds. Its application extends to the semiconductor industry, where it is utilized in chemical vapor deposition (CVD) processes to create thin films essential for electronic devices. Additionally, it plays a role in the development of coatings and adhesives, enhancing their durability and performance. In research, it is employed to modify surfaces, improving their properties for specific industrial applications.
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