Hexamethoxydisilane

95%

  • Product Code: 88487
  CAS:    5851-07-0
Molecular Weight: 242.37 g./mol Molecular Formula: C₆H₁₈O₆Si₂
EC Number: MDL Number:
Melting Point: Boiling Point: 98 °C /20 mmHg
Density: Storage Condition: 2-8°C, sealed, dry
Product Description: Used primarily in the production of silicon-based materials, it serves as a key precursor in the synthesis of silica gels and other silicon compounds. Its application extends to the semiconductor industry, where it is utilized in chemical vapor deposition (CVD) processes to create thin films essential for electronic devices. Additionally, it plays a role in the development of coatings and adhesives, enhancing their durability and performance. In research, it is employed to modify surfaces, improving their properties for specific industrial applications.
Sizes / Availability / Pricing:
Size (g) Availability Price Quantity
5.000 10-20 days ฿28,800.00
+
-
Hexamethoxydisilane
Used primarily in the production of silicon-based materials, it serves as a key precursor in the synthesis of silica gels and other silicon compounds. Its application extends to the semiconductor industry, where it is utilized in chemical vapor deposition (CVD) processes to create thin films essential for electronic devices. Additionally, it plays a role in the development of coatings and adhesives, enhancing their durability and performance. In research, it is employed to modify surfaces, improving their properties for specific industrial applications.
Mechanism -
Appearance -
Longevity -
Strength -
Storage -
Shelf Life -
Allergen(s) -
Dosage (Range) -
Dosage (Per Day) -
Mix Method -
Heat Resistance -
Stable in pH range -
Solubility -
Product Types -
INCI -

Cart

No products

Subtotal: ฿0.00
฿0.00 Total :