BIS(P-AMINOPHENOXY)DIMETHYLSILANE
95%
- Product Code: 88511
CAS:
1223-16-1
| Molecular Weight: | 274.39 g./mol | Molecular Formula: | C₁₄H₁₈N₂O₂Si |
|---|---|---|---|
| EC Number: | MDL Number: | MFCD00053930 | |
| Melting Point: | 64 °C | Boiling Point: | 195-199 °C /0.5 mmHg |
| Density: | 1.149±0.06 g/cm3(Predicted) | Storage Condition: | 2-8°C, sealed, dry |
Product Description:
Bis(p-aminophenoxy)dimethylsilane is primarily utilized in the synthesis of advanced polymers and resins. Its unique structure, featuring both amino and silane groups, makes it a valuable monomer for producing polyimides and other high-performance materials. These polymers are often employed in the electronics industry for manufacturing flexible printed circuit boards, insulating films, and coatings due to their excellent thermal stability and mechanical properties.
Additionally, this compound is used in the development of adhesives and sealants, where its silane functionality enhances adhesion to various substrates, including metals, glass, and ceramics. Its ability to improve interfacial bonding makes it a key component in composite materials, particularly in aerospace and automotive applications, where durability and resistance to harsh environments are critical.
In the field of surface modification, bis(p-aminophenoxy)dimethylsilane is applied to functionalize surfaces, improving their hydrophobicity or compatibility with other materials. This is particularly useful in coatings and protective layers for industrial equipment, ensuring enhanced performance and longevity.
Product Specification:
| Test | Specification |
|---|---|
| APPEARANCE | Amber to Brown Solid |
| PURITY | 94.5-100.0 |
| Infrared spectrum | Conforms to Structure |
| NMR | Conforms to Structure |
Sizes / Availability / Pricing:
| Size (g) | Availability | Price | Quantity |
|---|---|---|---|
| 5.000 | 10-20 days | $510.05 |
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| 25.000 | 10-20 days | $2,010.20 |
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BIS(P-AMINOPHENOXY)DIMETHYLSILANE
Bis(p-aminophenoxy)dimethylsilane is primarily utilized in the synthesis of advanced polymers and resins. Its unique structure, featuring both amino and silane groups, makes it a valuable monomer for producing polyimides and other high-performance materials. These polymers are often employed in the electronics industry for manufacturing flexible printed circuit boards, insulating films, and coatings due to their excellent thermal stability and mechanical properties.
Additionally, this compound is used in the development of adhesives and sealants, where its silane functionality enhances adhesion to various substrates, including metals, glass, and ceramics. Its ability to improve interfacial bonding makes it a key component in composite materials, particularly in aerospace and automotive applications, where durability and resistance to harsh environments are critical.
In the field of surface modification, bis(p-aminophenoxy)dimethylsilane is applied to functionalize surfaces, improving their hydrophobicity or compatibility with other materials. This is particularly useful in coatings and protective layers for industrial equipment, ensuring enhanced performance and longevity.
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