BIS[(3-METHYLDIMETHOXYSILYL)PROPYL]POLYPROPYLENE OXIDE
average Mw 600-800
- Product Code: 88526
CAS:
75009-88-0
| Molecular Weight: | Molecular Formula: | ||
|---|---|---|---|
| EC Number: | MDL Number: | MFCD01324941 | |
| Melting Point: | 166 °C (dec.)(lit.) | Boiling Point: | 600-800 °C |
| Density: | 1 g/cm3 | Storage Condition: | 2-8°C, sealed, dry |
Product Description:
This chemical is primarily used as a coupling agent or surface modifier in various industrial applications. It enhances the adhesion between organic polymers and inorganic materials, making it valuable in composite materials and coatings. Its silane groups react with inorganic surfaces, while the polypropylene oxide segment interacts with organic matrices, improving compatibility and performance.
In the automotive and construction industries, it is utilized in sealants, adhesives, and coatings to improve durability and resistance to environmental factors. It also plays a role in modifying fillers and reinforcements in polymer composites, enhancing mechanical properties and thermal stability. Additionally, it is employed in the production of specialty coatings for electronics, providing moisture resistance and improved adhesion to substrates.
Product Specification:
| Test | Specification |
|---|---|
| APPEARANCE | Clear Viscous Liquid |
| AVERAGE M.W. | 600 g/mol 800 g/mol |
| Infrared spectrum | Conforms to Structure |
Sizes / Availability / Pricing:
| Size (g) | Availability | Price | Quantity |
|---|---|---|---|
| 100.000 | 10-20 days | ฿14,720.00 |
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BIS[(3-METHYLDIMETHOXYSILYL)PROPYL]POLYPROPYLENE OXIDE
This chemical is primarily used as a coupling agent or surface modifier in various industrial applications. It enhances the adhesion between organic polymers and inorganic materials, making it valuable in composite materials and coatings. Its silane groups react with inorganic surfaces, while the polypropylene oxide segment interacts with organic matrices, improving compatibility and performance.
In the automotive and construction industries, it is utilized in sealants, adhesives, and coatings to improve durability and resistance to environmental factors. It also plays a role in modifying fillers and reinforcements in polymer composites, enhancing mechanical properties and thermal stability. Additionally, it is employed in the production of specialty coatings for electronics, providing moisture resistance and improved adhesion to substrates.
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